HSB07-202009
CUI Devices
HSB07-202009
CUI Devices
HEAT SINK, BGA, 20 X 20 X 9 MM
Utu Tohutoro (USD)
1+
$0.58140
500+
$0.575586
1000+
$0.569772
1500+
$0.563958
2000+
$0.558144
2500+
$0.55233
Whakapaipai ataahua
utu
TT / Paypal / Credit Card / Western Union / Money Gram
HSB07-202009
US$ 0.58
Taipitopito hua
Huanga Hua
- mana hua: Active
- momo: Top Mount
- mōkihi mātao: BGA
- tikanga taapiri: Adhesive
- ahua: Square, Pin Fins
- roa: 0.787" (20.00mm)
- whanui: 0.787" (20.00mm)
- diameter: -
- teitei o te tara: 0.354" (9.00mm)
- te tohanga mana @ te pikinga o te pāmahana: 3.1W @ 75°C
- ātete waiariki @ rere hau kaha: 8.60°C/W @ 200 LFM
- ātete waiariki @ māori: 24.08°C/W
- rauemi: Aluminum Alloy
- oti rawa: Black Anodized
Ka Hiahia Ano Koe
