HSB27-434316
CUI Devices
HSB27-434316
CUI Devices
HEAT SINK, BGA, 43.1 X 43.1 X 16
Utu Tohutoro (USD)
1+
$2.60000
500+
$2.574
1000+
$2.548
1500+
$2.522
2000+
$2.496
2500+
$2.47
Whakapaipai ataahua
utu
TT / Paypal / Credit Card / Western Union / Money Gram
HSB27-434316
US$ 2.60
Taipitopito hua
Huanga Hua
- mana hua: Active
- momo: Top Mount
- mōkihi mātao: BGA
- tikanga taapiri: Adhesive
- ahua: Square, Pin Fins
- roa: 1.697" (43.10mm)
- whanui: 1.697" (43.10mm)
- diameter: -
- teitei o te tara: 0.650" (16.51mm)
- te tohanga mana @ te pikinga o te pāmahana: 8.98W @ 75°C
- ātete waiariki @ rere hau kaha: 2.80°C/W @ 200 LFM
- ātete waiariki @ māori: 8.35°C/W
- rauemi: Aluminum Alloy
- oti rawa: Black Anodized
Ka Hiahia Ano Koe
