Ko te waahanga nui rawa atu o te ao mo nga waahanga hiko i roto i nga taonga mo te tuku tere!
Kia tutuki tonu, neke atu ranei i nga tumanako a nga kaihoko.
Ko E-XFL.COM he kaiwhakarato mana o nga waahanga hiko mo te neke atu i te 400 nga kaiwhakarato-a-ahumahi.
LOGO E-XFL
Reo RFQ

TH235-2-30G-2SYR

Penchem Technologies Sdn Bhd
TH235-2-30G-2SYR Preview
TH235-2-30G-2SYR
Penchem Technologies Sdn Bhd
NON SILICONE THERMAL PUTTY
Utu Tohutoro (USD)
1+
$30.30000
500+
$29.997
1000+
$29.694
1500+
$29.391
2000+
$29.088
2500+
$28.785
Whakapaipai ataahua
utu
TT / Paypal / Credit Card / Western Union / Money Gram
TH235-2-30G-2SYR

TH235-2-30G-2SYR

US$ 30.30

Taipitopito hua

Huanga Hua

  • mana hua: Active
  • momo: Non-Silicone Putty
  • rahi / rahi: 30 gram Syringe
  • awhe pāmahana taea: 5°F ~ 248°F (-15°C ~ 200°C)
  • tae: Blue
  • te kawe wera: 4.00W/m-K
  • āhuatanga: -
  • ora papa: 18 Months
  • te pāmahana rokiroki / whakamatao: -

Ka Hiahia Ano Koe

BT-301-200M
Wakefield-Vette

BT-301-200M

FAST CURING THERMALLY CONDUCTIVE
PK700DM-140-KIT
Shiu Li Technology Co., Ltd.

PK700DM-140-KIT

TWO-PART THERMAL LIQUID GAP FILL
TC3-10G
Chip Quik Inc.

TC3-10G

HEAT SINK THERMAL COMPOUND
PROHMPROTECT-3500-1.5
ProhmTect

PROHMPROTECT-3500-1.5

ELEC THERM COND PASTE NONSILIC 1
65-00-GEL30-0010
Parker Chomerics

65-00-GEL30-0010

THERM-A-GAP GEL30 3.5W/M-K 10CC
65-00-CIP35-0200
Parker Chomerics

65-00-CIP35-0200

THERM-A-FORM CIP35 POTTING 200CC
21-361-001-180M
Jones Tech

21-361-001-180M

THERMAL GEL 180CC PINK, 6WM-K
GF3500LV-00-240-50CC
Bergquist

GF3500LV-00-240-50CC

GAP FILLER 3500LV 50CC CARTRIDGE
TG-NSP35LV-30CC
t-Global Technology

TG-NSP35LV-30CC

NON-SILICONE THERMAL PUTTY 30CC
TG-NSP80-1OZ
t-Global Technology

TG-NSP80-1OZ

NON-SILICONE PUTTY 1OZ GREY

Nga Aromatawai Kounga Tohunga

Tau-a-Tau-a-Tau-a-Tau-a-Tau-Tau-Tau-Tau-Tau-Tau-Tau-Tau-Tau-Tau-Tau

Te Putanga o te Ao

Tautoko Kiritaki-a-Karaka

Top