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TH235-2-500G-JAR

Penchem Technologies Sdn Bhd
TH235-2-500G-JAR Preview
TH235-2-500G-JAR
Penchem Technologies Sdn Bhd
NON SILICONE THERMAL PUTTY
Utu Tohutoro (USD)
1+
$93.30000
500+
$92.367
1000+
$91.434
1500+
$90.501
2000+
$89.568
2500+
$88.635
Whakapaipai ataahua
utu
TT / Paypal / Credit Card / Western Union / Money Gram
TH235-2-500G-JAR

TH235-2-500G-JAR

US$ 93.30

Taipitopito hua

Huanga Hua

  • mana hua: Active
  • momo: Non-Silicone Putty
  • rahi / rahi: 500 gram Container
  • awhe pāmahana taea: 5°F ~ 248°F (-15°C ~ 200°C)
  • tae: Blue
  • te kawe wera: 4.00W/m-K
  • āhuatanga: -
  • ora papa: 18 Months
  • te pāmahana rokiroki / whakamatao: -

Ka Hiahia Ano Koe

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A17170-01

TPUTTY 508
t-Global Technology

TG-N909-30

NON-SILICONE THERMAL GREASE 30G
Techspray

1978-DP

SILICONE FREE HEAT SINK COMP.
ELBA LUBES

E1208E30CC

SILICONE GREASES 30 GRAMS
ProhmTect

PROHMPROTECT-3800-10.0

ELEC THERM COND PASTE NONSILIC 1
Chemtronics

CW7250

HEAT SINK GREASE BORON NITRIDE
Gelid Solutions LLC

TC-GC-03-D

THERMAL COMPOUND 1GR, 8.5W
Shiu Li Technology Co., Ltd.

H-PUTTY-100-KIT

THERMAL PUTTY 100G PLUS APPLICAT
Chip Quik Inc.

TC1-10G

HEAT SINK COMPOUND - HIGH DENSIT
Parker Chomerics

65-02-GEL45-0030

THERM-A-GAP GEL45 30CC EFD SYR

Nga Aromatawai Kounga Tohunga

Tau-a-Tau-a-Tau-a-Tau-a-Tau-Tau-Tau-Tau-Tau-Tau-Tau-Tau-Tau-Tau-Tau

Te Putanga o te Ao

Tautoko Kiritaki-a-Karaka

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