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PROHMSILVERFLOW-1.5

ProhmTect
PROHMSILVERFLOW-1.5 Preview
PROHMSILVERFLOW-1.5
ProhmTect
ELEC THERM COND PASTE NONSILIC 1
Utu Tohutoro (USD)
1+
$23.99000
500+
$23.7501
1000+
$23.5102
1500+
$23.2703
2000+
$23.0304
2500+
$22.7905
Whakapaipai ataahua
utu
TT / Paypal / Credit Card / Western Union / Money Gram
PROHMSILVERFLOW-1.5

PROHMSILVERFLOW-1.5

US$ 23.99

Taipitopito hua

Huanga Hua

  • mana hua: Active
  • momo: Non-Silicone Paste
  • rahi / rahi: 1.5cc Syringe
  • awhe pāmahana taea: -30°F ~ 550°F (-34°C ~ 288°C)
  • tae: Silver
  • te kawe wera: -
  • āhuatanga: -
  • ora papa: 24 Months
  • te pāmahana rokiroki / whakamatao: Room Temperature

Ka Hiahia Ano Koe

Shiu Li Technology Co., Ltd.

PK700DM-140

TWO-PART THERMAL LIQUID GAP FILL
Shiu Li Technology Co., Ltd.

N-PUTTY2-100

NON-SILICONE THERMAL PUTTY 100G,
Gelid Solutions LLC

TC-GC-03-A

THERMAL COMPOUND 3.5GR, 8.5W
ProhmTect

PROHMLUBE-1000-5.0

NON-COND CONTACT LUBE 5.0ML SYRI
Chip Quik Inc.

TC1-200G

HEAT SINK COMPOUND - HIGH DENSIT
Jones Tech

21-390-001-055M

THERMAL GEL 55CC BLUE, 9W/M-K
Penchem Technologies Sdn Bhd

TH235-2-30G-2SYR

NON SILICONE THERMAL PUTTY
Wakefield-Vette

BT-301-200M

FAST CURING THERMALLY CONDUCTIVE
Shiu Li Technology Co., Ltd.

PK700DM-140-KIT

TWO-PART THERMAL LIQUID GAP FILL
Chip Quik Inc.

TC3-10G

HEAT SINK THERMAL COMPOUND

Nga Aromatawai Kounga Tohunga

Tau-a-Tau-a-Tau-a-Tau-a-Tau-Tau-Tau-Tau-Tau-Tau-Tau-Tau-Tau-Tau-Tau

Te Putanga o te Ao

Tautoko Kiritaki-a-Karaka

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